Overview

Simplify Your Inspection Workflow

OLYMPUS Stream software offers intelligent step-by-step workflows to acquire sharp, crisp images that are ready for quantitative measurements and professional reporting based on the latest standards. Users of any experience level can conduct complex image analysis tasks, from image acquisition to standard reporting, under any imaging condition.

Designed for flexibility, the software has a broad scope of functions necessary to conduct fast, precise observations on a variety of samples while maintaining data security and reliability. Optional solutions enable users to adapt OLYMPUS Stream software to their application, including quality analysis, research and development, and quality control.

Try On OLYMPUS Stream for 30 days free of charge.

Click "Request a Demo" and note that you would like a 30-day license in the first box.

Easy-to-Use Interface and Step-by-Step Guidance

Smart Technologies for Crisp Image Capture

Tools for live images
Panorama and extended depth focus
Saving and recalling acquisition settings

High Efficiency on Repeating Tasks

Guided operation
Quantitative analysis
Automatic tools for efficient image acquisition
Efficient report creation

Designed for Olympus Hardware

Seamlessly Integration with Olympus Optical Microscopes

Upright microscopes
Inverted microscopes
Semiconductor microscopes
Stereo microscopes
LEXT 3D measuring laser microscope
DSX digital microscope

Working with Olympus Digital Cameras

Color fidelity
High resolution
Real-time on-screen imaging

Dedicated Observation Methods

HDR imaging for image contrast improvement
Unique 'MIX' observation mode providing sample details from both brightfield and darkfield

Solving Your Inspection Challenges

Advanced Imaging Solutions

Count and measure solution
Three-dimensional image display and measurement

Solutions for Metallography

Grain sizing using the intercept counting method
Grain sizing using the planimetric method
Graphite nodularity evaluation
Rating the non-metallic inclusion content
Comparison of sample images with reference standards
Dendrite arm spacing measurement

Solutions for Machinery Processing (Automotive / Machined Parts Industries)

Welding distortion
Phase and region of interest measurement
Particle distribution

Solutions for Electronics (Electronic Device / Semiconductor Industries)

Throwing power measurement
Automatic critical dimension measurement

Solutions for Surface Coatings and Thin Film Deposits (Coating Industries)

Thin coating thickness evaluation (calotest method)
Layer thickness measurement
Pore fraction and density measurement

Smart Technology

Step-by-Step Guidance

The dynamic user interface reduces desktop clutter and confusion by only displaying the tools and functions you want to use. The interface guides you through every step of the process, including image capture, image processing, and report creation. Both simple and complex measurements can be easily conducted using the software’s intuitive set of tools.

Simple Layouts

The software’s organized layouts contain the minimum necessary functions for performing the required tasks. Simplified layouts help streamline the inspection workflow and efficiently guide users through the inspection process.

Fast measurements on a live image with just a few clicks of your mouse

Tools for Live Images

Estimating the pore size using live digital reticules (Cross section of die casting)

The software supports live image functions for instant feedback. The software enables you to interact with the live image, which is automatically calibrated, and perform quantitative measurements.

Quick Panorama and Extended Depth Focus

Quickly create images of samples that extend beyond the standard depth of focus or the field of view. The instant extended focus image (EFI) function uses the fine focus adjustment to combine many images taken at different Z-levels to build a single combined image that is entirely in focus. Instant multiple image alignment (MIA) makes it easy to create panoramic images simply by moving the XY stage; a motorized stage is no longer necessary.

Instant EFI image of crystal: fully focused image is created even in low-contrast sample areas

Instant MIA image of a coin

Recall Acquisition Setting

Quickly recall previously used camera settings to capture repeatable images with a consistent look and feel. When using a motorized microscope, this function can automatically recall previous hardware settings. If you’re using a BX, GX, or MX series microscope, the software guides you to manually recall settings.

Operation Step	Operator A	Operator B
Different operators use different settings
Easily verify the correct settings
Synchronize observation settings
Regardless of different operators, the settings are the same

3D Solution

3D profilometry of wear track

This solution creates height maps from stacks of images acquired automatically or manually at different Z positions. The resulting image can be visualized in three dimensions using the surface view. Measurements, such as 3D profiles and height differences between two or several points, can be performed, and the results exported into workbooks and Microsoft Excel spreadsheets.

Guided Operation for Specific Analyses

The software guides you through the correct order of functions when performing image analysis, including methods that comply with most common international standards. When using a motorized stage, the alignment feature speeds up your work on multiple sample locations.

Learn more

Automatic Calibration

The automatic calibration feature uses a standard micrometer to calibrate the microscope and automatically generates a calibration report. This helps eliminate user variability in the calibration process for more reliable measurements.

Automated Inspection Tools

The software’s automated tools can create a very large set of data in just a few minutes. Automatic magnification calibration using a calibrated grating reticle helps ensure that your images are displayed with the proper scale bar and that your measurements are confirmed. Large areas can be imaged automatically using motorized XYZ stages, enabling the creation of images of large parts with high resolution.

Sharp and high-contrast MIA image of integrated circuit (IC) pattern (dark field observation with 20X objective lens)

Quantitative Information That Matters

The software tools features quantitative information about your sample. Interactive measurements on live and still images provide the basic dimensional information (length, area, and diameter), and the results are directly visible on the image.
Advanced interactive measurements include the magic wand and complex polygonal shapes for semiautomatic area measurement, while the count and measure solution provides access to more than a one-hundred single particle parameters for quantitative analysis based on the threshold method.

Basic measurement (supra conductor)

Magic wand (supra conductor)

Object detection (supra conductor)

Efficient Report Creation

Creating a report often takes longer than capturing the image and taking the measurements. With the software, you can repeatedly produce smart and sophisticated reports based on predefined templates. Editing is simple, and reports can be exported to Microsoft Word, Excel, or PowerPoint. In addition, the software’s reporting tool enables digital zooming and magnification on acquired images. Report files are a reasonable size for easier data exchange by email.

Professional report that summarizes particle counting data

Your System

Customize Your Software Package

Developed for Olympus microscopes, OLYMPUS Stream software is a powerful and user-friendly measurement tool. There is no need to manually record the optical parameters of Olympus UIS2 objectives when using it with a conventional microscope. Magnification calibration is also not required when importing images from our DSX and LEXT microscopes. The software is available from entry-level to advanced packages.

OLYMPUS Stream Packages

OLYMPUS Stream software is available in four packages based on functionality—Start, Basic, Essentials, and Motion.
Application-specific materials solution modules can be added to streamline repetitive analysis tasks. Olympus representatives can help you determine which package is right for you.

Learn more

Seamlessly Integrates with Most Olympus Optical Microscopes

Control Upright Microscopes

BX53M microscope and software system

The BX53M microscope employs coded functions that integrate the microscope’s hardware settings with OLYMPUS Stream software. The observation method, illumination intensity, and objective position are all recorded by the software and/or the handset. The microscope settings can be automatically saved with each image, making it easier to reproduce the settings at a later time and provide documentation for reporting purposes.

View our upright microscopes

Control Inverted Microscopes

GX53 microscope and software system

Our digital cameras provide high-resolution viewing and fast image transfer while our software provides all the tools needed for today's complex metallurgical requirements.
Choose from extended measurements, standard metallography, and advanced metallography application-specific modules (over a dozen application specific routines are available), and automatically populate data and create reports that comply with common ASTM and ISO specifications.

View our inverted microscopes

Control Semiconductor Microscopes

Integrated microscope and software system

We offer several software platforms that integrate with our semiconductor microscope frames to control all motorized functions, including the digital camera and motorized stage. Each interface is designed for basic inspection and control, advanced image analysis, or repetitive site inspection and defect review.

View our semiconductor microscopes

Control Stereo Microscopes

SZX16 microscope and software system

Our stereo microscope motorized focus drive makes digital documentation with extended focal imaging (EFI) efficient and fully automatic. This even enables the creation of pseudo 3D images. The software offers tools for simple 2D measurements up to complex phase analysis and support many operations including observation, report generation, database creation, and archiving.

View our stereo microscopes

Enhance the Power of Olympus Confocal and Digital Microscopes

Use OLYMPUS Stream software for post-processing (Stream Desktop) with the complete range of DSX series digital microscopes and the LEXT 3D measuring laser microscope.

LEXT 3D measuring laser microscope

DSX digital microscope series

View the LEXT 3D Measuring Laser Microscope
View the DSX Digital Microscope

Supports Most Olympus Digital Cameras

Resolution and Color Fidelity

The low-noise, high-resolution images of a 9-megapixel sensor enable the user to zoom deep into the sample, revealing its structures (sandstone)

Excellent spatial resolution combined with a high pixel count exploit the full optical resolution of the objectives and enable the structures and details within the smallest samples to be imaged, even with low magnification objectives. High-definition images enable you to make observations exclusively on-screen without using the eyepieces.

Reveal More with Infrared (IR)

IR image of the backside from a Si wafer,
taken with the XM10-IR monochrome
camera

IR imaging mode is a fundamental tool for quality control and in R&D laboratories. IR mode enables nondestructive inspection through silicon layers of packaged products during the back end stage of fabrication.

View our digital cameras

Dedicated Observation Methods for Materials Science

HDR imaging for enhanced contrast

High dynamic range (HDR) imaging improves image contrast in difficult conditions (very bright areas together with very dark areas in the same image). All cameras supported by OLYMPUS Stream software can be used in this mode, and dedicated cameras have an available live mode.

Clearly exposed for both dark and bright parts by HDR (Sample: fuel injector bulb)

Contrast enhancement by HDR (Sample: Sliced magnesite)

MIX observation to visualize sample’s surface structure

The software supports our MIX observation

This illumination technique combines directional darkfield, which uses a circular LED to illuminate one or more quadrants at a given time, , and brightfield, fluorescence, or polarization, enabling you to highlight defects and differentiate raised surfaces from depressions that are normally difficult to see with conventional microscopes. MIX observation helps reduce a sample’s halation and is useful for visualizing a sample’s surface texture.


Conventional: brightfield shines the light straight down on the sample while traditional darkfield highlights scratches and imperfections on a flat surface by illuminating the sample from the side of the objective			Advanced: MIX is a combination of brightfield and directional darkfield from a ring of LEDs; the LEDs can be adjusted to select which direction to illuminate from

Solutions

Solving Your Inspection Challenges

Industrial labs often require repeatable and reproducible results as part of their standard operating procedures. OLYMPUS Stream software facilitates inspection, measurement, and analysis with a simple and reliable workflow. The software offers a variety of tools for various materials science analyses, so you can be confident in your results.

Olympus industrial microscopes support metallurgical analysis solutions

Count and Measure Solution

The software’s count and measure solution uses advanced threshold methods to reliably separate objects, such as particles and scratches, from the background. More than 50 different object measurement and classification parameters are available, including shape, size, position, and pixel properties.


Conventional software Unclear grain boundaries		Etched steel microstructure (original image)		OLYMPUS Stream Grain boundaries are clearly detected

Grain classification results

Efficient Analysis

Example of Macro Manager set up for Count and Measure

You can preset complex imaging and measurement tasks with the macro manager and then execute it with a single click.

Powerful Image Filters

Enhanced contrast using the DCE filter (dendrite in an aluminum casting)

The software has a variety of useful filters for edge detection, smoothing, and other purposes.

TruAI™ Deep-Learning Technology

Image segmentation using conventional threshold methods that depend on brightness or color can miss critical information or targets in samples. The OLYMPUS Stream TruAI solution offers a more accurate segmentation approach using deep-learning technology for a highly reproducible and robust analysis.

Intuitive user interface to efficiently label images and train robust models with excellent generalization properties
Pre-trained networks can be applied to future analyses for a similar application
Deep-learning image segmentation is useful for a range of materials science applications, including metallic analysis, semiconductor quality control, and mineralogy

Learn more about TruAI deep learning

Original image of brown coal ash fly (left) in OLYMPUS Stream, image segmentation using conventional thresholding methods (right).

Original image of brown coal ash fly (left) in OLYMPUS Stream, deep-learning image segmentation (right).

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source

Olympus Stream™ Tutorial: Train a Neural Network

Three-Dimensional Measurement and Line Profiles

The OLYMPUS Stream 3D solution provides coded and motorized Z control and instant EFI with height mapping capabilities to measure a three-dimensional sample.

3D surface view (Roughness test sample)

Single view and 3D profile measurement

Solutions for Metallography

Metallography is used in materials development, incoming inspection, production and manufacturing control, and failure analysis.

Grain sizing using the intercept counting method
Grain sizing using the planimetric method
Graphite nodularity evaluation
Rating the content of non-metallic inclusions in high-purity steel
Compare sample images with reference standards
Automatically or manually measure dendrite arm spacing

Solutions for Machinery Processing (Automotive / Machined Parts Industries)

To produce parts that are high quality, scratches, cracks, pore size, and contamination is strictly monitored during the production process.

Welding distortion
Phase and ROIs measurement
Particle distribution

Solutions for Electronics (Electronic Device / Semiconductor Industries)

In printed circuit boards, very thin plates are coated and verifying the homogeneity of this coating is a key element of product quality.

Throwing power measurement
Automatic critical dimension measurement

Solutions for Surface Coatings and Thin Film Deposits (Coating Industries)

Surface coatings are any mixture of film-forming materials that contain pigments, solvents, and other additives, which, when applied to a surface and cured or dried, yields a thin film that is functional and often decorative.

Thin coating thickness evaluation (calotest method)
Layer thickness measurement
Pore fraction and density measurement

Custom Workflow Solutions

The Olympus customization team designs personalized workflows in OLYMPUS Stream software for specific application scenarios. The software operation process is set up for your requirements so you can quickly solve challenges and achieve goals in your industrial microscope inspections.

Learn more about custom workflow solutions

Materials Solutions for Every Purpose

Solutions	Descriptions
Grain Intercept	Steel manufacturers use this solution for measuring and controlling grain size after cross-sectioning, polishing, or etching steel samples. This function is based on overlaying of “test lines” and counting the number of intercepts with grain boundaries.
Grain Planimetric	Steel manufacturers use this solution for measuring and controlling grain size after cross-sectioning, polishing, or etching steel samples. This function reconstructs boundaries for each grain and conducts grain sizing with the area percentage of the second phase.
Non-Metallic Inclusions	Steel manufacturers use this solution for measuring and controlling the shape and size of nonmetallic inclusions (oxide, alumina, sulfide, or silicate) in steel.
Cast Iron	Casting manufacturers who need to measure and control the graphite nodularity and check the mechanical characteristics of their cast products use this solution.
Chart Comparison	A live or still image can be overlaid onto standard charts for comparison. Function preview is available.
Dendrite Arm Spacing	This solution is used to manually or automatically determine the mean dendrite arm spacing in cast aluminum.
Layer Thickness	One or multiple layers of a cross-sectioned sample can be measured using the Layer Thickness solution. The shapes are defined, and the layers automatically measured.
Coating Thickness	This solution enables the measurement of coating thickness from top-view images using the Calotest method.
Automatic Measurements	This solution is used for creating measurements based on edge-detection on a live image with pattern recognition.
Throwing Power	This solution measures the distribution of copper plating thickness in through-holes or micro-vias.
Porosity	This solution enables pores to be measured either for area fraction or the number of surface pores using ROIs (circular, triangular, rectangular, and polygonal) and thresholds.
Particle Distribution	This solution is used to create particle size distribution histograms and tables from multiple images or image series.
Advanced Phase Analysis	This feature offers a new integrated solution to perform phase analysis on a selection of various regions of interest (ROIs) including triangles, circles, rectangles, and polygons.

Solutions	Metal/ Casting	Automotive	Glass/ Ceramic	Coating	Consumer goods	Electronic devices
Grain Intercept	■	■		■
Grain Planimetric	■	■		■
Inclusion Worst Field	■	■		■
Cast Iron	■	■		■
Chart Comparison	■	■		■
Layer Thickness		■
Coating Thickness		■
Automatic Measurements					■	■
Throwing Power					■	■
Porosity	■	■	■	■	■	■
Particle Distribution	■	■	■	■	■	■
Advanced Phase Analysis	■	■	■	■	■	■

Solutions	Semicon ductors	Fluids & oils	Machined parts	Carbon/ Composites	Chemical/ Plastic/ Rubber	Industrial scientific research
Grain Intercept		■			■	■
Grain Planimetric		■			■	■
Inclusion Worst Field		■			■	■
Cast Iron		■			■	■
Chart Comparison		■			■	■
Layer Thickness					■	■
Coating Thickness						■
Automatic Measurements
Throwing Power
Porosity	■	■	■	■	■	■
Particle Distribution	■	■	■	■	■	■
Advanced Phase Analysis	■	■	■	■	■	■

Specifications

Main License Specifications

■: Standard □: Optional		Start	Basic	Essentials	Motion	Desktop
Image Acquisition	Basic image acquisition including HDR and auto-calibration of magnification and Live HDR1, and position navigation¹	■	■	■	■
	Software autofocus^*2 and movie acquisition (Avi format)		■	■	■
	Time lapse, Instant EFI, and Instant/Manual MIA^*3		□	■	■
	Motorized EFI/MIA and Z-stack acquisition		□	□	■
Image and Customization Tools	Basic tool windows (Image history, properties, navigator, gallery view tool window)^*4	■	■	■	■	■
	Annotations, layer management, scale bar, cross hair, info stamp display, and image filters	■	■	■	■	■
	Digital reticle/grid, line profile display, My Function, layout management, and Macro Manager		■	■	■	■
Measurements/ Image Analysis	Basic interactive measurement (distance, angles, rectangles, circles, ellipses, polygons, circle-to-circle distance, angle ruler, and line ruler) and data export to MS-Excel	■	■	■	■	■
	Phase analysis, magic wand, freehand polyline, interpolated polygon, morphology filter, and image arithmetics		□	■	■	■
	3D measurements, 3D profile measurements, and 3D surface view		□	□	■	■
Reporting*⁵	Report creation (MS-Word, and MS-Excel formats)		■	■	■	■
Reporting*⁵	Presentation creation		□	□	□	□
Data Management	Stream document storage^*6		■	■	■	■
Data Management	Workgroup Database with structured data format		□	□	□	□
Device Support	Olympus microscopes^7 and Olympus cameras^8	■	■	■	■
	Non-Olympus cameras and image source converter^*9		■	■	■
	Non-Olympus stage controller^*9		□	□	■

PC Requirements
CPU	Intel® Core i5, Intel® core i7, Intel® Xeon
RAM / Hard disk / DVD drive	4 GB or more (8 GB recommended)/2.4 GB or more free space/DVD+R DL compatible
OS*¹⁰	Windows 10 Pro (64-bit) , Windows 8.1 (64-bit) Pro
.NET Framework	Version 4.6.2 or higher
Graphic card*¹¹	1280 × 1024 monitor resolution with 32-bit video card
Web browser	Windows Internet Explorer 8, 9, 10, or 11

*1Requires the DP74 camera, and the Live HDR function requires 64-bit OS.
*2 Requires Olympus microscope with motorized Z-axis or external motorized Z-axis with OLYMPUS Stream Motion or Automation Solution
*3 Instant MIA may not work properly with some cameras
*4 Write and read all major file formats and open Olympus proprietary formats (DSX, LEXT and POIR file formats)
*5 Requires Microsoft Word 2010, 2013, 2016, 2019, or Office 365 to be installed beforehand (not provided).
*6 Using Microsoft SQL Server Express
*7 Supports BX53M, BX2, IX2, GX, GX53, SZX, SZX2, SZX-ZE, MX, MX63, MX63L, MVX, STM7-CB, CBS, BX3M-CB, BX3M-CBFM, BX-REMCB.
*8 8 Supports LC20, LC30, DP22, DP23, DP27, DP28, DP73, DP74, SC30, SC50, SC100, SC180, UC30, UC50, UC90, XC10, XC30, XC50, XM10.
*9 Please contact Olympus for supported device information
*10 Olympus cameras work with all supporting operating systems.
*11 Required configurations for LiveHDR in DP74. Graphic board applicable to CUDA made by NVIDIA (compute capability 2.1 or higher). Graphic board driver applicable to CUDA 9.1 or higher.

Special Solution Specifications

□

Solutions	Compatiblity				Functions
Solutions	Basic	Essentials	Motion	Desktop	Measurement Type
3D	□	□	Included	Partially included^*	3D Surface View, 3D Measurement, 3D Profile Measurement, Motorized Z-stack/EFI, Instant EFI with height map (requires coded or motorized Z-axis).
Automation	□	□	Included		Automation Solution (Motorized/Manual/Instant MIA, Motorized/Instant EFI without height map (requires coded or motorized XYZ-axis) and with time lapse.
Weld Measurement	□	□	□	□	Weld Measurement solution (measurements for geometric distortion introduced by the heating during welding).
Count & Measure	□	□	□	□	Multiple threshold methods are available (automatic, manual HSV, manual and adaptative) The system can automatically measure multiple parameters on all segmented objects (Area, Aspect Ratio, Bisector, Bounding Box, Gravity Center, ID, Mass Center, Intensity Values, Convexity, Diameters, Elongation, Feret, Extent, Next Neighbor Distance, Orientation, Perimeter, Radius, Shape, Sphericity, etc.) Spreadsheet and charts with individual and distribution measurements.
TruAI™ Deep-Learning Technology		□	□	□	Accurate and automated image segmentation

* Not possible to use the functions relating to image acquisition

Materials Solutions Specifications

Solutions	Compatiblity			Output
Solutions	Basic	Essentials/ Motion	Desktop	Automatic report creation	Workbook with individual measurement	Store all results in the image properties
Grain Intercept	□	□	□	■	■	■
Grain Planimetric	□	□	□	■	■^*2	■
Non-Metallic Inclusions	□	□	□	■	■	■
Cast Iron	□	□	□	■	■	■
Chart Comparison	□	□	□		■	■
Layer Thickness	□	□	□	■	■
Coating Thickness	□	□	□	■	■	■
Dendrite Arm Spacing	□	□	□	■	■	■
Automatic Measurements	□	□			■
Throwing Power	□	□		■	■	■
Porosity	□	□	□	■	■	■
Particle Distribution	□	□	□	■	■	■
Advanced Phase Analysis	□	Included	Included	■	■

Solutions	Functions
Solutions	Measurement type	Supported standards	Multiple stage location^1 Sample alignment^1
Grain Intercept	Selection of pattern (circles, cross, cross & circles, vertical lines, horizontal lines, horizontal & vertical lines) Definition of the number of test lines for determination of grain elongation Displays the G-value in the Material Solution tool window	ASTM E112-13, ISO 643:2012, JIS G 0551:2013, JIS G 0552:1998, GOST 5639-82, GB/T 6394-2002, DIN 50601:1985, ASTM E1382-97(2015)	■
Grain Planimetric	Automatic extraction of grain boundaries User interaction using Stream sliders for improved usability Displays the G-value histogram in the Material Solution and position navigation^*1 for direct interaction	ASTM E112-13, ISO 643:2012, JIS G 0551:2013, JIS G 0552:1998, GOST 5639-82, GB/T 6394-2002, DIN 50601:1985, ASTM E1382-97(2015)	■
Non-Metaric Inclusions	Automatic detection of non-metallic inclusion using colors, shape, and size Automatic classification of oxides, sulfides, silicates, and aluminates Worst field: On each field the worst inclusion will be measured Live display of the detected inclusion with its rating Average content: The entire sample is scanned with a motorized stage On each field an inclusion rating is performed The result is given as a table “quantity of fields for each severity level”	ASTM E45-18 (method A), DIN 50602:1985 (method M), ISO 4967:2013 (method A), GB/T 10561-2005 (method A, equivalent to ISO 4967), JIS G 0555:2003 (method A, equivalent to ISO 4967), UNI 3244:1980 (method M), EN 10247:2017 (methods P and M), SEP 1571:2017 (methods M and K), ASTM E45-18 (method D), ISO 4967:2013 (method B), EN10247:2017 (method K).	■
Cast Iron	On polished samples: automatically measures the characteristics of the graphite content (size, shape, and distribution) On etched samples: measures the ferrite to pearlite ratio Integrated workflow that takes into account the sample status (etched or polished)	EN ISO 945-1:2018, ASTM A247-17, JIS G 5502:2001, KS D 4302:2006, GB/T 9441-2009, ISO 16112:2017, JIS G 5505:2013, NF A04-197:2017, ASTM E2567-16a (for nodularity only)
Chart Comparison	Multiple displays available, including live overlay User interaction using Stream sliders for improved usability Calculates statistics on the selected values	ISO 643: 1983, ISO 643: 2012, ISO 945-1:2008, ASTM E 112: 2010, EN 10247: 2007, DIN 50602: 1985, SEP 1572: 1971, SEP 1520: 1998, ISO 4505:1978
Layer Thickness	Layer boundaries can be specified using automatic detection, magic wand, or manual mode (using 2 or 3 points). Individual measurements can be added or deleted later on Measurement of any type of layers (with even or uneven boundaries) is supported. Layer thickness measurement calculates mean, maximum, and minimum values as well as statistical data for each individual layer.
Coating Thickness	Prints are measured from top view Calculation of the coating thickness according to the sample geometry	EN 1071-2:2002, VDI 3824: 2001, ISO 26423:2016
Dendrite Arm Spacing	Determines the mean dendrite arm spacing in cast aluminum alloys
Automatic Measurements	Automatically measures distances (point-to-point, point-to-line, circle-to-circle, point-to-circle, line-to-circle) Automatically measures circle diameter (roundness, bounding box) Automatically measures angles between two lines Definition of tolerances values for measurement and visual validation Expert and user mode for measurement repeatability		■
Throwing Power	Manual measurements of selected point of interest on the sample Predefined points that will be triggered by the operator Selection of the vias type and documentation of the analysis Report and automatic calculation according to the manual measurements
Porosity	Pore detection per ROIs (triangle, circle, rectangle, polygon, or magic wand) with overlapping capability Measurement of the pore density, count, and specific area Measurement of the biggest pore Measurement of a specified size range	VW 50093/ P6093:2012, VDG P201-2002, VDG P202-2010, VDG P211-2010	■
Particle Distribution	Particles are defined using simplified threshold settings. Automatic classification according to a selected parameter (size, color, or shape) Measurement of ROIs and multiple thresholds Definition of validation and coding according to user-defined standards		■
Advanced Phase Analysis	Phase fraction per ROIs (triangle, circle, rectangle, or polygon) Magic wand, freehand polyline, interpolated polygon, morphology filter, and image arithmetics also usable Measurement of the total phase percentage per phase and per ROI Selectable minimum area detection		■