*To guarantee XY accuracy, calibration work must be undertaken by an Olympus service technician.
With the DSX1000 digital microscope:
Complete your inspection using one easy-to-use systemWith a conventional digital microscope:
Two microscopes, a low-magnification and a high-magnification model, are needed to complete an inspectionWith the DSX1000 digital microscope:
High resolution and long working distance in one objectiveWith a conventional digital microscope:
Resolution decreases as magnification increasesWith the DSX1000 digital microscope:
Observe uneven samples without bumping into themWith a conventional digital microscope:
The objective can crash into the sample, potentially damaging itWith the DSX1000 digital microscope:
All 6 observation methods are available at all magnificationsWith a conventional digital microscope:
Only one or two observation methods are available, limiting what can be seen in the sampleWith the DSX1000 digital microscope:
Both accuracy and repeatability are guaranteed at all magnificationsWith a conventional digital microscope:
The measurement precision is not guaranteedYou can meet various observation needs with the DSX1000 Series from entry level to high end.
Our lineup of 17 objective lenses, including super long working distance and high numerical aperture options, offers flexibility to obtain a wide range of images.
Provides a long working distance between the lens and sample.
Delivers both high resolution and a long working distance.
Delivers high performance at the nano scale.
| DSX10-SZH | DSX10-UZH | ||
| Optical System | Optical system | Telecentric optical system | |
| Zoom ratio | 10X (motorized) | ||
| Zoom magnification method | Motorized | ||
| Calibration | Automatic | ||
| Lens attachment | Quick-switch, coded lens attachments automatically update magnification and visual field information | ||
|
Maximum total magnification
(on monitor) | 7000X | ||
| Working distance (W.D.) | 66.1 mm – 0.35 mm | ||
| Accuracy and repeatability (X-Y plane)*1 |
Accuracy of magnification: 3%
Repeatability of magnification: ± 2% = 3 σ n -1 | ||
| Repeatability (Z axis)*2 | Repeatability (height): σ n – 1 ≤ 1 μm | ||
| Camera | Image sensor | 1 / 1.2 inch, 2.35 million pixel color CMOS | |
| Cooling | Peltier cooling | ||
| Frame rate | 60 fps (maximum) | ||
| Standard | 1200 × 1200 (1: 1) / 1600 × 1200 (4: 3) | ||
| 3 CMOS mode | Not available | 1200 × 1200 (1: 1) / 1600 × 1200 (4: 3) | |
| 3 CMOS mode × pixel shift | Not available | 3600 × 3600 (1: 1) / 4800 × 3600 (4: 3) | |
| Illumination | Color light source | LED | |
| Lifetime | 60,000 h (design value) | ||
| Observation | BF (brightfield) | Standard | |
| OBQ (oblique) | Standard | ||
| DF (darkfield) |
Standard
LED ring divided into four divisions | ||
| MIX (brightfield+darkfield) |
Standard
Simultaneous observation of BF + DF | ||
| PO (polarization) | Standard | ||
| DIC (differential interference) | Not available | Standard | |
| Contrast up | Standard | ||
| Depth of focus up function | Not available | Standard | |
| Transmitted lighting | Standard*3 | ||
| Focus | Focusing | Motorized | |
| Stroke | 101 mm (motorized) | ||
*1 Calibration by Olympus or dealer service technician necessary. To guarantee the accuracy of XY, calibration with DSX-CALS-HR (calibration sample) is required. To issue certificates, calibration work must be undertaken by an Olympus’ calibration service technician.
*2 When using a 20X or higher objective.
*3 The optional DSX10-ILT is required.
| Objective | DSX10-SXLOB | DSX10-XLOB | UIS2 | |
| Objective lens | Maximum sample height | 50 mm | 115 mm | 145 mm |
|
Maximum sample height
(free angle observation) | 50 mm | |||
| Parfocal distance | 140 mm | 75 mm | 45 mm | |
| Lens attachment | Integrated with lens | Available | ||
| Total magnification | 20X – 1400X | 42X – 5600X | 23X*4 – 7000X | |
| Actual F.O.V. (μm) | 19,200 µｍ – 270 µｍ | 9,100 µｍ – 70 µｍ | 17,100 µｍ – 50 µｍ | |
| Adaptor | Diffusion adaptor (optional) | Available | Not Available | |
| Eliminate reflection adaptor (optional) | Available | Not Available | ||
| Lens attachment | Number of objectives that can be attached |
Up to 1 piece
(attachment is integrated with lens) | Up to 2 pieces | |
| Objective lens case | Three lens attachments can be stored | |||
*4 Total (maximum) magnification when using MPLFLN1.25X
| Stage | DSX10-RMTS | DSX10-MTS | U-SIC4R2 |
| XY stage: motorized / manual | Motorized (with rotation function) | Motorized | Manual |
| XY stroke |
Stroke priority mode: 100 mm × 100 mm
Rotation priority mode: 50 mm × 50 mm | 100 mm × 100 mm | 100 mm × 105 mm |
| Rotation angle |
Stroke priority mode : ±20°
Rotation priority mode : ±90° | Not available | |
| Display rotation angle | GUI | Not available | |
| Load-resistance | 5 kg (11 lb) | 1 kg (2.2 lb) | |
| Frame | DSX-UF | DSX-TF |
| Z-axis stroke | 50 mm (manual) | |
| Tilt observation | Not available | ±90° |
| Tilt angle display | Not available | GUI |
| Tilt angle method | Not available | Manual, fix / release handle |
| Measurement | Plane measurement |
| Profile measurement | |
| Step measurement | |
| Area/volume measurement | |
| Line roughness analysis | |
| Surface roughness analysis | |
| Caliper measurement (optional) | |
| Particle analysis (optional) |
| Display | 23-inch flat panel display |
| Resolution | 1920 (H) × 1080 (V) |
| System total | Upright frame system | Tilt frame system |
| Weight (frame, head, motorized stage, display, and console) | 43.7 kg (96.3 lb) | 46.7 kg (103 lb) |
| Power consumption | 100 – 120 V / 220 – 240 V, 1.1 / 0 .54 A, 50 / 60 Hz | |
A brake pad's surface impacts its performance, including braking force, heat stability, noise, and heat generation. Digital microscopes are used to check that the compounds used to create the brake pad are mixed properly.
| Automotive |
Digital microscopes are effective tools for analyzing defects, such as wire breakage, wire pitch deviation, bonding peeling, and migration that can occur during the bonding process.
|
Electronics
IC/Wafer |
Drill bits are widely used in industrial fields as a cutting tool. If the edge is damaged, inaccuracies may arise during hole positioning, or the drill may break. Conventional digital microscope is commonly used to perform drill inspection, but there are challenges. The DSX1000 offers advantages of detecting damage on a drill bit edge.
|
Metal
Fabrication/Mold |
Semiconductors are essential components in many electronic devices. Defects can be introduced into the circuit during manufacturing process, and visual inspection using a microscope is a preferred option to inspect defects. The DSX1000 simplifies semiconductor visual inspection.
|
Electronics
IC/Wafer |
Manufacturers use strict quality control measures to minimize failures of electrical connector pins, and microscopes play an essential role. The DSX1000 microscope’s objective lenses offer the depth of focus and resolution required to focus an entire connector pin at the same time, greatly simplifying and speeding up the inspection process.
|
Electronics
IC/Wafer |
Fractography has become increasingly important as infrastructure continues to age and quality control issues cause problems. Optical or digital microscopes are essential fractography tools that are used to capture high-quality images for analysis. See details of advantages which DSX1000 can offer to analyze factured metal surfaces.
|
Metal
Fabrication/Mold |
During the dicing process of integrated circuit (IC) manufacturing, amount of allowable roughness of wafer surface is carefully controlled. Amount of roughness is checked with a digital microscope, but the physical properties of IC chips can be challenging. The DSX1000 objective lenses offer high resolution at low magnification to reduce shading and flare, enabling inspectors to more easily see chipping during low-magnification observations.
|
Electronics
IC/Wafer |
Inspection of resin peeling defects is critical as these defects can cause a completed PWB to have lower insulation and heat resistance, making them more susceptible to failure. PWBs are challenging to inspect with a microscope. The DSX1000 digital microscope has advanced telecentric optics and high-resolution objectives that offer an excellent depth of focus, which enable you to observe an etched PWB to investigate the cause of a defect.
|
Electronics
IC/Wafer |
Manufacturers measure the laminated ceramic capacitors’ dimensions and visually inspect them to look for cracks in the ceramic. Microscopes or digital microscopes is used to supplement the automated inspection system, but poses challenges. The DSX1000 offers multiple advantages to inspect capacitors.
|
Electronics
IC/Wafer |
During the manufacturing process of PWBs, a microscopic inspection is necessary to analyze circuit shape precisely. There are multiple advantages of measuring circuit shape with the DSX1000.
|
Electronics
IC/Wafer |
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