在线研讨会 - 使用涡流阵列技术对应力腐蚀开裂缺陷进行检测

The latest developments and upgrades to the OmniScan MX platform, with an emphasis on the Eddy Current Array module and Bond Testing C-scan.

This Webinar includes an introduction and overview of the innovative new Bond testing C-scan solution for the inspection of composite honeycomb structure using the OmniScan MX flaw detector. Attendees will learn about the powerful benefits of this solution and its advantages compared to existing techniques of testing composite materials. Attendees will learn why bond testing is possible with an eddy-current based instrument and will be shown the different scanning options featuring a new hand scanner. Attendees will see a live demonstration of the new MXB software’s simplicity and dynamic inspection capabilities that is dedicated to Bond Testing.  You will learn about pitch-catch bond testing method, multiple frequency scanning, amplitude and phase displays, system calibration, data interpretation and archiving.

The purpose is to show how to start an ECA set up from scratch to get an C-scan image.