_{Microscope Solutions for}
Semiconductor Manufacturing

Checking for Defects Caused from Die Bonding

A part of the die bonder sometimes hits and scratches the surface of the IC chip. To fix the issue, the cause of the scratches must be identified using detailed inspections.

Our Solution

Our BX and MX series microscopes can observe defects on IC chips with high magnification.

BX series metallurgical microscope View Product Details

MX series semiconductor microscope View Product Details

IC chip after die bonding

Application Notes

Explore related applications:

	Measuring the Surface Roughness of a Lead Frame Die Pad Read More
	Roughness Evaluation of the Inner Lead of a Lead Frame / Surface Roughness Measurement of a Micro Area using a Laser Microscope Read More