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Microscope Solutions for
PCB Manufacturing

Processing the Outer Layer

Circuits are formed on both sides of the multilayer substrate using the same process as the inner layer.

Managing the Plating Thickness

Inspectors must check the thickness of the plated copper on a PCB to make sure that the copper is evenly plated on the board.

Our Solution

Our DSX series digital microscope or BX series metallurgical microscope combined with OLYMPUS Stream™ software enables you to measure the distribution of copper plating thickness in through holes or micro-via with a simple inspection workflow.

BX series metallurgical microscope with OLYMPUS Stream software

BX series metallurgical microscope with OLYMPUS Stream software

DSX series digital microscope with OLYMPUS Stream software

DSX series digital microscope with OLYMPUS Stream software

Cross-section of a through hole

Cross-section of a through hole

Application Notes

Explore related applications:

Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity
Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity Read More
Inspecting Glass Fiber Peeling in a Printed Wiring Board's Glass Epoxy Substrate Clear Images Are Essential for Quality Control
Inspecting Glass Fiber Peeling in a Printed Wiring Board's Glass Epoxy Substrate Clear Images Are Essential for Quality Control Read More
Measuring the Circuit Shape of a Printed Wiring Board Using a Digital Microscope
Measuring the Circuit Shape of a Printed Wiring Board Using a Digital Microscope Read More

BX series metallurgical microscope

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DSX series digital microscope

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Measuring the Via Hole Dimensions

The via-hole is used for electric conduction between layers of the substrate pattern. The width and depth of the via-hole must be measured.

Our Solution

Our STM series measuring microscope can measure the dimension of the via hole.

STM series measuring microscope

STM series measuring microscope

DSX series digital microscope with OLYMPUS Stream software

Position to be measured by the STM series microscope

Application Notes

Explore related applications:

Measuring the Circuit Shape of a Printed Wiring Board Using a Digital Microscope
Measuring the Circuit Shape of a Printed Wiring Board Using a Digital Microscope Read More
Measuring the shape of an automotive millimeter-wave radar's circuit board
Measuring the Shape of an Automotive Millimeter-Wave Radar's Circuit Board Read More
Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity
Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity Read More

Checking the Copper Pattern for Defects

Inspectors must check for the presence of defects in copper patterns to help ensure safe, normal power distribution.

Our Solution

Our DSX series digital microscopes and BX series metallurgical microscopes provide high-magnification observation of defects on copper patterns.

DSX series digital microscope with OLYMPUS Stream software

DSX series digital microscope with OLYMPUS Stream software

BX series metallurgical microscope with OLYMPUS Stream software

BX series metallurgical microscope with OLYMPUS Stream software

High magnification image of copper pattern

High-magnification image of the copper pattern

Application Notes

Explore related applications:

Measuring the Circuit Shape of a Printed Wiring Board Using a Digital Microscope
Measuring the Circuit Shape of a Printed Wiring Board Using a Digital Microscope Read More
Contaminants in Printed Circuit Board (PCB) Through-Holes
Contaminants in Printed Circuit Board (PCB) Through-Holes Read More
Inspecting Bonding Wires Using aDigital Microscope
Using the Olympus OLS5000 Laser Confocal Microscope to Measure the Surface Roughness of Printed Circuit Boards Read More

DSX series digital microscope

Request a Quote

BX series metallurgical microscope

Request a Quote

Measuring the Copper Pattern

The dimensions of the copper wire can impact electric conduction, so inspectors must measure it to help ensure safe, normal power distribution.

Our Solution

Our DSX1000 digital microscope can provide cross-sectional images of copper patterns in 3D, enabling height and width measurements.

DSX series digital microscope with OLYMPUS Stream software

DSX series digital microscope with OLYMPUS Stream software

3D image of copper pattern

A 3D image of copper pattern

Application Notes

Explore related applications:

Measuring the Circuit Shape of a Printed Wiring Board Using a Digital Microscope
Measuring the Circuit Shape of a Printed Wiring Board Using a Digital Microscope Read More
Inspecting Bonding Wires Using aDigital Microscope
Using the Olympus OLS5000 Laser Confocal Microscope to Measure the Surface Roughness of Printed Circuit Boards Read More
Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity
Using Image Analysis Software to Measure Throwing Power or PCB Copper Plating Thickness Uniformity Read More
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