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Height Measurement of Microscopic Bumps on an Integrated Circuit


Image of microscopic bumps on an integrated chip.
Image of microscopic bumps on an integrated chip.

Measuring the Height of Microscopic Bumps for Flip Chip Bonding

Mounting integrated circuit (IC) chips on a printed circuit board (PCB) using a grid of microbump solders is a technique called flip chip bonding. To ensure a proper connection between the IC and PCB, the height of the bumps must be uniform. For this reason, the bump height must be measured quickly and accurately during production.

Measuring the Height of Microscopic Bumps for Flip Chip Bonding

Measuring the Height of Microscopic Bumps for Flip Chip Bonding

Olympus' Solution: Height Measurement Using the OLS5000 Industrial Microscope

The LEXT OLS5000 3D laser scanning microscope can provide precise and fast height measurement at the microscopic level thanks to a range of innovative features:

(1) With the microscope’s unique PEAK algorithm, it takes only about 10 seconds to acquire data in a 649 µm × 640 µm area of bumps 20 µm high.

(2) The system has a multiple-area data acquisition function, which enables you to specify multiple areas and obtain the data of those areas simultaneously.

Olympus' Solution: Height Measurement Using the OLS5000 Industrial Microscope
 

(3) By setting the height reference plane for the image to be acquired, you can measure the heights of all the bumps within the field of view at one time.

Setting the reference plane for height measurement.

Setting the reference plane for height measurement.

All the bump heights within the field of view can be automatically measured.

All the bump heights within the field of view can be automatically measured.
 

(4) All the details and steps of an operation you have performed can be stored as a template when producing a report. When repeating a measurement, you can reload the template to obtain a report analyzed using the same procedure parameters.

(5) Typical bump measuring systems inspect bumps at high speed, but they do not work well for very fine microscopic bumps. The OLS5000 microscope helps ensure accuracy and reproducibility suitable for the height measurement of microscopic bumps.

Olympus IMS

Products used for this application


LEXT OLS5000NEW

With the Olympus LEXT OLS5000 laser scanning confocal microscope, noncontact, nondestructive 3D observations and measurements are easy to produce. Simply by pushing the Start button, users can measure fine shapes at the submicron level. Ease of use is combined with leading-edge features to deliver an acquisition speed four times faster than our previous model. For customers with larger samples, LEXT long working distance objectives and an extended frame option allow the system to accommodate samples as large as 210 mm.
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