"OmniScan MX: New developments and upgrades"
Hello, my name is Tommy Bourgelas
and I am the product manager of eddy current
and bond testing products with Olympus NDT.
I would like to introduce you to the latest developments
and upgrades to the OmniScan MX platform,
with an emphasis on the Eddy Current Array module.
For those who do not know, the OmniScan MX is a portable,
modular, and world-recognized instrument
which features a large color display
and supports several different inspection technologies
including Eddy Current, Ultrasound, Phased Array
and now, Bond testing C-scan
Today I’d like to focus on the Eddy Current Array module.
This module has 3 connectors.
It allows running a single channel absolute BNC probe,
or most conventional ECT probes
through its universal 19-pin connector.
This module comes into two versions;
one that has two ECT connectors
and one that also includes an OmniScan ECA connector.
The OmniScan Eddy Current Array connector
features 32 channels and automatic probe recognition
for extremely easy setup of ECA.
Although most applications will require up to 32 channels,
the channel count can be expanded up to 64 if needed,
with the help of an external multiplexer.
I would like to start this demonstration
with a tour of the new MXE 3.0 Eddy Current Array software
that resides in the OmniScan MX ECA
This version features major improvements
that makes eddy current array technology easy
and accessible to any eddy current inspector.
For this demonstration, I will be using the latest eddy current array
probe kit for aircraft fastener inspection.
The MXE 3.0 software starts in the “MAIN” menu
being very similar to the worldwide-acclaimed
Nortec 500 flaw detector.
The MAIN menu features all basic controls
such as frequency, probe drive,
angle, gain, and vertical gain.
Thanks to the MXE 3.0 new live impedance plane,
operating an ECA probe has never been easier.
You can now perform lift-off adjustment,
and gain adjustment like with a conventional ECT probe.
The difference is that there are not only one,
but 32 channels displayed on the impedance plane.
Because of the large coverage and resolution
of eddy current array technology,
the probability of detection is very high
while maintaining fast scanning speeds
thanks to the electronic scanning of the coils.
However, it’s the color imaging
that makes this technology particularly interesting.
The OmniScan MX ECA can generate
time-based color C-scans as well as encoded scans
in order to build the most comprehensive inspection image.
There are only few basic steps to configure
the new MXE 3.0 software for eddy current arrays.
Once the basic impedance plane settings are done,
simply turn on the C-scan display....
Then, activate the encoder....
And now you are ready to inspect.
The new MXE 3.0 software
also features a new continuous encoder mode
that allows continuous scanning
while recording only the relevant indications as needed.
This allows the user to benefit from the image quality
typical of encoded scans.
"Color Imaging"
Eddy Current Array technology, or ECA,
is eddy current technology with electronic switching.
Eddy current arrays have the same capabilities
as conventional eddy currents.
As such, ECA technology allows not only detection of
surface-breaking or near sub-surface flaws,
but also provides valuable information on a flaw’s depth
through observation of the signal amplitude or phase change.
The MXE 3.0 software features new intuitive color representations
that allow instant flaw depth estimation,
provided that a proper reference standard has been used
to calibrate the sensitivity.
As can be seen, the instrument is setup to
display the flaw depth from color difference.
"Replacement of conventional NDT methods"
The OmniScan MX ECA state of the art
technology and software makes it a great replacement tool
to traditional NDT methods such as penetrant testing,
magnetic particle, and magneto-optic imagery.
When compared to penetrant testing
on large surface inspections,
the OmniScan MX ECA offers several key advantages such as:
No need for paint removal
as eddy currents employ magnetic coupling;
Imagery and archiving capabilities;
One step inspection, at high scanning speed,
and providing instant results;
Huge time savings, 10:1 are typical;
Drastically reduced turnaround time;
Defect depth evaluation or go-no-go;
Adjustable sensitivity and post-process analysis;
Environmentally friendly, as no chemicals are involved.
Archiving is extremely simple with the OmniSCan MX ECA.
The instrument features a Compact Flash card
that can be removed to transfer
the different inspection-created files onto a PC
and archived on a disk for later use.
Any time during the inspection,
a single press of the SAVE key
will automatically generate and store both a data file
and a screen image,
which can be included when creating reports.
The analysis can be done any time,
either by pausing the instrument during inspection
or by reading back a data file already stored.
The indications can be quickly verified
with the newly redesigned MXE 3.0 intuitive cursor controls.
Simply press the cursor key
or connect a regular USB computer mouse
to speed up the analysis.
"High quality ECT signals"
The MXE 3.0 software now allows
quick switch to ECT technology.
Simply press and hold the blue menu button
and you can start displaying high quality signals
using most conventional Nortec probes
through the universal or BNC ECT probe connectors.
The ECT part of the MXE 3.0 software
includes the same user-friendly interface
and improvements as presented earlier.
In addition, some newly-added features
such as the moveable null point
make the OmniScan MX ECT mode compatible
with most aerospace eddy current procedures.
"Bond testing re-invented"
The new OmniScan MX Bond Testing C-scan
is THE most reliable and user-friendly
honeycomb composite structure inspection solution.
This solution is based on the existing OmniScan MX platform,
the ECT or ECA modules,
and the existing BondMaster pitch-catch probes.
It runs on new MXB software
which is derived from the MXE software.
It also uses a new bond testing adaptor box
that converts the bond testing probe signals
for the ECT or ECA module.
In order to generate the C-scan image,
a dual axis scanning device must be used,
such as the Olympus Glider scanner,
the Wing Scanner
or a new hand scanner designed to hold
the bond testing probe in a convenient format.
The OmniScan MX Bond Testing C-scan
features instant imagery
8 simultaneous frequencies,
and amplitude and phase C-scan displays
for an easy detection of disbonds,
delamination or identification of repair areas.
And just like the MXE eddy current array software,
the MXB bond testing C-scan software
allows the user to freeze and/or save the inspection
and evaluate the size of a flaw
with use of the MXB intuitive cursors system.
Whether it is used to perform high speed
color eddy current array imaging scans,
or as a conventional eddy current flaw detector,
or to generate multi-frequency Bond testing C-scans,
the OmniScan MX with the eddy current array module
lets you discover what you have been missing
Eddy Current Imaging.
The Omniscan MX ECA is an easy to use
portable flaw detector for every level of user.
For the latest updates in Eddy current,
bond testing and other innovative Olympus solutions,
you can contact your local representative
or visit us online at www.olympus-ims.com.