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Hello, my name is Tommy Bourgelas

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and I am the product manager
of eddy current

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and bond testing products
with Olympus.

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I would like to introduce you to
Olympus’ latest development

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of next-generation, high-performance
composite bond testers,

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the BondMaster 600.

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The BondMaster 600 is a portable,

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lightweight and field proven
instrument.

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It weighs only 1.7 kg

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and has a battery life of
up to 9 hours.

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Combined with the brilliant
full VGA display,

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these features make the BondMaster 600
the perfect instrument

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for inspection in the most
demanding conditions.

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Connections include an I/O
and VGA output connector,

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as well as a USB port to exchange
files with a computer.

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The BondMaster 600 comes
with an internal

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micro SD card for
backup purposes,

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and an accessible micro SD
card for data transfer.

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The BondMaster 600 is available
in two models.

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The basic model offers an
all pitch-catch mode capability

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and the multi-mode version
supports pitch-catch,

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mechanical impedance analysis (MIA)

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and resonance test methods.

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Additionally, the BondMaster 600
supports

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existing Olympus PowerLink probes,

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as well as competitor probes
and accessories.

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Simplified Interface and
Vibrant Display

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What differentiates the BondMaster 600
from other instruments

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is its intuitive ease of use through
all test modes,

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making the instrument accessible
to all levels of users.

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The improved and simplified
interface includes:

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Application presets for
instant configuration

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An All Settings menu to
quickly configure

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the instrument from a procedure.

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and Instant Access keys

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The BondMaster 600 also features
a true full screen mode,

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accessible instantly from a
single press of a key.

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The user can also toggle
from available

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display modes by pressing the RUN key.

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Signal Quality Beyond Comparison

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The BondMaster 600s’ highly
advanced digital electronics

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provide unmatched signal
quality in all test modes.

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The pitch-catch mode in particular,
has been improved.

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The addition of a new AUTO gate

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reduces setup time and
operator errors.

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The real-time readings display
live signal measurements

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such as amplitude and phase.

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The pitch-catch test mode is
available in three methods:

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RF, IMPULSE and Swept.

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Detecting smaller defects
has never been easier

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with the improved mechanical
impedance analysis test mode

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of the BondMaster 600.

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The extended frequency range of
2 kHz to 50 kHz in MIA mode

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opens the door to potentially
untapped applications.

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Additionally, the MIA mode allows

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identification of repaired
(or potted) areas

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versus normal or disbonded conditions.

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The Resonance mode
has been designed to offer

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instant setup to inspect for
metal to metal disbonds

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and composite delamination.

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The intuitive interface

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and improved reference dot system
allow the instrument

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to calibrate the resonance mode

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in a simplified number of steps.

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OEM Friendly,
New Tools for Procedure Development

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The instrument also includes
new features

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to facilitate the development of bond
testing applications and procedures.

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Its new SPECTRUM view of the
pitch-catch swept method,

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combined with its new frequency
tracking feature

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allows better understanding of a
test piece frequency response.

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Additionally, the improved
calibration menu

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of the MIA test mode helps the user
to select the best test frequency.

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Complete Archiving and Reporting

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The BondMaster 600 can store
up to 500 files,

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which can be loaded or previewed

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from the MEMORY menu
of the instrument.

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The inspection, archiving and
reporting workflow

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has been simplified.

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You can now instantly
SAVE data during inspection.

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You can download and view files
on a computer

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with “BondMaster PC” software.

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And you can now produce
reports instantly

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thanks to the new
“Export all files as PDF” function.

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With its high quality signals,

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field proven design,
and extremely intuitive interface,

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the BondMaster 600 is the perfect
choice for any level of user.

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For more information on
Olympus Bond testing solutions,

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contact your local representative

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or visit us online at
www.olympus-ims.com.