The review and classification of defects detected by wafer inspection systems is critical to product development and the manufacturing process. The Olympus designed MX-IRP software program allows the user to inspect wafers using imported defect maps from both patterned and unpatterned wafer inspection tools and observe defects under multiple observation methods, including Brightfield, Darkfield, Nomarski, DIC (Differential Interference Contrast) and DUV. After the review process, defect files are updated with classification data and corresponding images and can be uploaded to the user's yield management system.

MX-IRP Inspection and Defect

Wafer Map

Automated solution ・Improves throughput and ergonomics

All motorized microscope functions and sub-assemblies on the Olympus MX61A are controlled via the MX-IRP software. This includes the objective turret, lamphouse intensity, aperture, motorized stage, digital camera, motorized DIC prism and our newly introduced laser autofocus system, developed specifically for high-speed semiconductor inspections.

Compact footprint ・Cost-effective approach, reducing space allocation

The tabletop system interfaces with the Olympus MX series of optical wafer inspection microscopes for 100 to 300mm wafers, significantly reducing the required fab space as compared with fully integrated defect review stations.

Image Analysis ・Defect documentation and measurement

In addition to the inspection and review process, defects are documented through image capture and measurements can be performed for dimensional analysis. Annotations are saved directly on the image.

Olympus designed GUI ・Robust platform minimizing downtime

The MX-IRP software was developed with Olympus proven expertise in inspection and defect review systems. The well-received platform makes it easy to interactively inspect wafers for defects and navigate through the wafer map for defects via pre-programmed routines.

Yield management integration ・Works with your existing system

Process and yield engineers rely on a broad range of inspection techniques to track defects and maximize yields. The MX-IRP system interfaces with industry standard review files and yield management systems. Defect locations, classification data and corresponding images can all be uploaded to the user yield management system.

Fast and accurate ・Maximizes yield, saving time and money

Encoded stages and the specially designed on-board stage control ensure precise defect navigation and die-to-die reproducibility.

Multiple imaging techniques ・Wafer inspection under standard and advanced microscopy methods

MX-IRP is ideal for any stage of the wafer manufacturing process, from product development to failure analysis. Using the exceptional optical quality of the Olympus UIS2 optics and MX series of wafer inspection microscopes, defects are analyzed under Brightfield, Darkfield, Nomarski DIC (Differential Interference Contrast) and DUV.