Bond Testing Improvements
Important to Note
Olympus is proud to launch our new bond testing OmniScan® solution—a big step forward in the field of composite inspection. Now, easy-to-read C-scan imagery is possible using a portable instrument. This OmniScan solution is ideally suited for disbond detection in honeycomb composite, as well as equally accurate delamination detection. Primarily designed for aerospace in-service inspection, this solution is also useful for the manufacturing sector, including the automotive and naval industries (e.g., for composite boat hulls).
Customers who already own an OmniScan® ECA or ECT module only need to order the standard BondMaster® probes (P14 and SPO-5629) and the BondMaster cable that are required to complete this solution.
Our customized MXB software has been developed especially for composite inspection; new features, such as the wizard and normalization, help to keep operation simple for the user.
Encoded system: any two-axis encoding scanner can be used to inspect a part. Olympus offers two options: the GLIDER™ scanner, which is well-suited for flat or slightly curved surfaces, and the WING™ scanner, which is specially designed for scanning curved parts (e.g., aircraft fuselages) and can even be used upsidedown due to its Venturi vacuum-cup system. For more versatility, a handheld one-axis encoding scanner, equipped with an Indexer Clicker, is also compatible with this system.
Again, Olympus innovates by introducing a new way of displaying on-screen data. For each C-scan, the operator has two viewing options to choose from: the amplitude C-scan displays color variation based on the amplitude of the signal, regardeless of the phase, which is ideal for clear and efficient disbond detection; or, the phase C-scan uses a 0° to 360° color palette to display changes in the phase angle, making it easy to distinguish between different types of indications, such as putty (repair) and delamination.
Phased C-scan, cursor over potting
Low-frequency scan; amplitude C-scan cursor over disbond
High-frequency scan; phase C-scan, different color palette
High-frequency scan; phase C-scan, cursor over delamination
Two C-scan view
Full screen C-scan view
Flaw size estimation feature
This solution is available in two different configurations, both requiring these standard components.
OmniScan MX and ECA/ECT module
BondMaster probe adaptor for OmniScan
HSB-01 handheld scanner
SPO-5629-PHV probe with ACIX1520 probe holde
S-PC-P14 probe with ACIX1519 probe holder