The BondMaster® 600 delivers a powerful combination of multiple mode bond testing software and highly advanced digital electronics, providing consistently crisp and high-quality signals. Whether you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the BondMaster 600 offers exceptional ease-of-use thanks to its direct-access keys and streamlined interface that features convenient presets for common applications. The enhanced user interface and simplified workflow of the BondMaster 600 offers archiving and reporting that are accessible to any level of user.
The resolution and brightness of the 5.7-inch VGA screen on the BondMaster 600 handheld bond tester becomes even more apparent when switched into full-screen mode. Activated by the simple touch of a key, the full-screen mode is always accessible regardless of the display mode or inspection method you are using. The BondMaster 600 bond tester is programmed for a range of standard inspection methods, including pitch-catch RF, pitch-catch impulse, pitch-catch swept, resonance, as well as a notably improved mechanical impedance analysis (MIA) method.
The BondMaster 600’s case, based on a rugged, field-proven design, is world-renowned for withstanding the harshest, most demanding inspection conditions. The BondMaster 600 with its long battery life, airtight and water-resistant enclosure, high-friction bumpers, and dual-duty support stand/hook is a valuable tool for challenging inspection jobs.
The BondMaster 600 is offered in two models to accommodate the varying needs of composite bond testing. The basic model includes all pitch-catch capabilities, while the B600M model features all bond testing inspection methods. The upgrade from basic to multimode can also be performed remotely.
Both BondMaster 600 models are compatible with existing Olympus BondMaster probes, including those equipped with the PowerLink technology. Optional adaptor cables are available to enable compatibility with probes from other manufacturers.
|General Honeycomb Composites Skin-to-Core Disbonds||Pitch-Catch (RF or IMPULSE)|
|Honeycomb Composites Skin-to-Core Disbonds in Tapered Structures or Non-Constant Geometries||Pitch-Catch (Swept)|
|Smaller Skin-to-Core Disbonds in Honeycomb Composite||MIA|
|Identification or Repaired Areas in Honeycomb Composite||MIA|
|General Detection of Delamination in Composite||Resonance|
|Inspection of Metal-to-Metal Bonds||Resonance|
|Feature||B600 (basic)||B600M (multimode)|
|PowerLink Probe Support||√||√|
|Pitch-Catch RF and Impulse Modes||√||√|
|Mechanical Impedance Analysis (MIA) Mode||√|
|Calibration Menu (Resonance and MIA Modes)||√|
One of the major assets of the BondMaster® 600 is its unprecedented ease of use. Its streamlined and user-friendly interface was developed by incorporating innovative features from other Olympus products and combining them with several new functions, including the Application Selection (presets) menu, the All Settings direct modification screen, and the ability to calibrate signals while in Freeze mode.
All the advantages offered by the BondMaster 600 interface are available in 15 languages.
The BondMaster 600 features a comprehensive set of direct-access keys, allowing instant adjustment of commonly used parameters, such as gain, full-screen mode, display mode (RUN), and more. Signals are displayed in eight vivid and identifiable color schemes, and the screen’s enhanced visibility in indoor and outdoor conditions helps reduce operator eye fatigue.
The BondMaster® 600 offers a completely streamlined and straightforward process for tracking your inspection results. Built-in features such as a large storage capacity (up to 500 data and program files) and an on-board file preview have been created to facilitate the inspection process, from start to finish.
A typical workflow consists of a few simple steps: save your results during the inspection process, download the saved files to the new BondMaster PC viewing software, instantly generate a full inspection report using the new “Export all files as PDF” function, and archive the report if required.
Press the SAVE key anytime during the inspection to record signals as viewed.
Quickly download results to BondMaster PC through USB connection.
Produce a complete report with the touch of a single key, and archive results as needed.
During bond testing inspections, the pitch-catch probe produces flexural plate waves and compression waves, and compares changes in the signal amplitude between the probe’s transmitter and receiver as it passes over the inspected part, detecting disbonds on both the near and far side. The BondMaster® 600 offers three Pitch-Catch mode options: RF (fixed frequency waveform), Impulse (legacy view featuring an envelope filter), or Swept (sweeping through a selected frequency range).
The Pitch-Catch menus of the BondMaster 600 have been optimized to provide fast access to the parameters that are adjusted most frequently during calibration and inspection. The real-time readings provide instantaneous information on the signal amplitude or phase, enabling you to interpret flaws more easily. The new Auto Gate mode automatically detects the best “gate” position based on the RF or impulse signal, reducing operator error and maximizing the results.
Pitch-catch in impulse display split screen. The X-Y view (right) shows a record of both near and far side disbonds (phase difference).
The BondMaster 600 Pitch-Catch Swept mode not only features improved signal quality, but also has a new “Spectrum” representation. This new view displays the live amplitude and phase of the signal compared to the frequency range. Two new frequency markers (called frequency tracking) allow you to observe the behavior of two specific frequencies so that you can choose the best detection parameters for a specific application. This new tool is ideal for developing procedures or new applications.
Spectrum view with frequency tracking.
Resonance mode measures the changes in phase and amplitude of the propagating/standing wave within the probe. Resonance probes are narrow bandwidth contact transducers, and the changes in probe crystal impedance is represented in the X-Y display of the BondMaster® 600.
Resonance mode is a very simple and reliable way to detect delamination. Often, the depth of delamination can be estimated from signal phase rotation. Resonance mode on the BondMaster 600 is remarkably easy to operate, due in large part to its factory presets for laminate composite and metal-to-metal disbond applications.
Resonance mode configured as “go-no-go”.
Calibration of Resonance mode on the BondMaster 600 has been simplified to a minimum number of steps. First the optimum operating frequency for the probe is selected through the single-step calibration menu, and then the streamlined interface of the BondMaster 600 and the ability to calibrate from frozen signals make the final calibration quick and simple.
Once calibrated, the improved signal reference and reference dot system of the BondMaster 600 enables you to easily track critical signals on the display during inspection. Moreover, its reference points system is so flexible that you can fine-tune the calibration without having to rerecord the points.
The bond testing mechanical impedance analysis (MIA) method measures the mechanical impedance, or stiffness, of a material. MIA probes emit a fixed, audible frequency. Changes in material stiffness are indicated as signal amplitude and phase changes in X-Y view of the BondMaster® 600.
The small probe tip used with MIA, coupled with the high-performance electronics of the BondMaster 600, make detecting very small disbonds in honeycomb composite much easier than with other methods. Moreover, the extended MIA frequency range of the BondMaster 600 (2 kHz to 50 kHz) obtains maximum results, even for far side disbonds.
The BondMaster 600 features a simple MIA calibration wizard that guides you in selecting the best possible frequency for detecting smaller and otherwise hard-to-find defects in honeycomb composite.
MIA mode with new “Scan” view and real-time readings.
The BondMaster 600 also displays real-time readings showing signal amplitude or phase, and its new “Scan” view allows you to monitor the probe amplitude and phase over time, aiding in the detection of small disbonds.
Identifying repaired areas on aircraft rudders or fuselage can be a challenge, especially when they are painted. With certain inspection methods, such as thermography, repairs can generate false indications. However, MIA mode can resolve this problem. Because the repaired area is generally stiffer, its mechanical impedance contrasts well with good areas as well as with disbonds.
The improved MIA method offered by the BondMaster 600 allows you to identify repaired areas with ease, through a simple phase analysis of the MIA signal in the X-Y view.
MIA mode configured to identify repaired area (bottom signal) as opposed to disbonded condition (top signal).
For a complete specifications list, please download the full BondMaster® 600 user’s manual.
General > Overall Dimensions
(W × H × D)
|236 mm × 167 mm × 70 mm (9.3 in. × 6.57 in. × 2.76 in.)|
|General > Weight||1.70 kg (3.75 lb), including lithium-ion battery|
|General > Standards or Directives||Mil Standard 810G, CE, WEEE, FCC (USA), IC (Canada), RoHS (China), RCM (Australia and New Zealand), KCC (South Korea)|
|General > Power Requirements||AC Mains: 100 VAC to 120 VAC, 200 VAC to 240 VAC, 50 Hz to 60 Hz|
|General > Inputs and Outputs||One USB 2.0 peripheral port, one standard VGA analog output port, one 15-pin I/O port (male) with analog output, 3 alarm outputs.|
|Environmental Conditions > Operating Temperature||–10 °C to 50 °C (50 °F to 122 °F)|
|Environmental Conditions > Storage Temperature||0 °C to +50 °C (32 °F to 122 °F) [with batteries] and -20 °C to +70 °C (-4 °F to 158 °F) [without batteries]|
|Environmental Conditions > IP Rating||Designed to meet requirements of IP66|
|Battery > Battery Type||Single lithium-ion rechargeable battery or AA size alkaline batteries (in an 8-cell holder).|
|Battery > Battery Life||Between 8 to 9 hours|
Display > Size
(W × H; Diagonally)
|117.4 mm × 88.7 mm; 146.3 mm (4.62 in. × 3.49 in.; 5.76 in.)|
|Display > Type||Full VGA (640 × 480 pixels) color, transflective LCD (liquid crystal display).|
|Display > Modes||Normal or Full screen, 8 color schemes. RUN key to toggle between screen modes.|
|Display > Grids and Display Tools||Choice of 5 grids, crosshairs (X-Y views only)|
|Connectivity and Memory > PC Software||BondMaster PC software, included in base BondMaster 600 kit. BondMaster PC allows viewing saved files and printing reports.|
|Connectivity and Memory > Data Storage||500 files featuring user-selectable on-board preview.|
|Connectivity and Memory > Languages||English, Spanish, French, German, Italian, Japanese, Chinese, Russian, Portuguese, Polish, Dutch, Czech, Hungarian, Swedish, and Norwegian.|
|Connectivity and Memory > Applications||Application Selection menu for easy and rapid configuration in all modes.|
|Connectivity and Memory > Real-Time Readings||Choice of up to 2 real-time readings measuring signal characteristics (list depends on selected mode)|
|Probes Types Supported > Probe Types||Pitch-Catch, Mechanical Impedance Analysis (MIA-B600M only) and Resonance probes (B600M only). The instrument is fully compatible with BondMaster PowerLink and non-PowerLink probes, as well as those of other main probe and accessory suppliers.|
|Bond Testing Specifications (All BondMaster Models) > Probe Connectors||11-pin Fischer|
|Bond Testing Specifications (All BondMaster Models) > Gain*||0 dB to 100 dB in 0.1 or 1 dB increments|
|Bond Testing Specifications (All BondMaster Models) > Rotation*||0° to 359.9° in 0.1° or 1° increments|
|Bond Testing Specifications (All BondMaster Models) > Scan View*||Variable from 0.520 s to 40 s|
|Bond Testing Specifications (All BondMaster Models) > Low Pass Filter*||6 Hz to 300 Hz|
|Bond Testing Specifications (All BondMaster Models) > Probe Drive||LOW, MEDIUM, and HIGH user-adjustable settings|
|Bond Testing Specifications (All BondMaster Models) > Variable Persistence*||0.1 s to 10 s|
|Bond Testing Specifications (All BondMaster Models) > Variable Display Erase*||0.1 s to 60 s|
|Bond Testing Specifications (All BondMaster Models) > Available Alarm Types*||3 simultaneous alarms. Choices include BOX (rectangle), POLAR (circle), SECTOR (pie), SCAN (time-based), and SPECTRUM (frequency response).|
|Bond Testing Specifications (All BondMaster Models) > Reference Dots*||Up to 25 user-defined dot recordings|
|Pitch-Catch Specifications (All B600 Models) > Supported pitch-catch modes||User-selectable mode. Choice of RF (toneburst), Impulse (envelope) or Swept (frequency sweep)|
|Pitch-Catch Specifications (All B600 Models) > Frequency Range||1 kHz to 50 kHz (RF, Impulse) or 1 kHz to 100 kHz (Swept)|
|Pitch-Catch Specifications (All B600 Models) > Gain||0 dB to 70 dB in 0.1 or 1 dB increments|
|Pitch-Catch Specifications (All B600 Models) > Gate||10 μs to 7920 μs, adjustable in 10 μs steps. New Auto Gate mode automatically detects maximum amplitude.|
|Pitch-Catch Specifications (All B600 Models) > Frequency Tracking*||Up to 2 user-adjustable markers to monitor 2 specific frequencies from the Swept figure.|
|Mechanical Impedance Analysis (MIA) Specifications (B600M Only) > Calibration Wizard||Calibration menu to determine best frequency for application, based on simple “BAD PART” and “GOOD PART” measurements|
|Mechanical Impedance Analysis (MIA) Specifications (B600M Only) > Frequency Range||2 kHz to 50 kHz|
|Mechanical Impedance Analysis (MIA) Specifications (B600M Only) > Calibration Wizard||Calibration menu to determine best frequency based on the probe response|
|Mechanical Impedance Analysis (MIA) Specifications (B600M Only) > Frequency Range||1 kHz to 500 kHz|
The BondMaster® 600 is available in any of the following configurations:
Model: Basic and Multi-mode (M) .
Power cord: Over 11 power cord models available (for the DC charger).
Keypad and instruction label: English, international (icons), Chinese, or Japanese.
“Getting Started” print manual: over 9 languages available.
Items included in all BondMaster 600 models†: BondMaster 600 instrument with factory-installed hand strap, getting started manual, calibration certificate, rigid transport case, DC charger with power cord, Li-ion battery, AA battery tray, USB communication cable, MicroSD memory card and adaptor, Pitch-catch and MIA probe cable, and BondMaster PC software and product manuals disc.
†Standard inclusions may vary depending on your location. Contact your local distributor.
Additional items included in BondMaster 600M model only: Resonance probe cable.