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Welcome to this instructional video

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on the BondMaster 600 bond tester.

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This video illustrates how to use

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the BondMaster 600 tester in
Mechanical Impedance Analysis

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(or MIA) test mode to detect
smaller disbonds

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in honeycomb composite.

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Part One
Basic Setup

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For typical inspection procedures,

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such as inspecting
an aircraft component,

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turn on the instrument and
connect the MIA probe.

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When prompted, press CONTINUE,

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then ACCEPT to load
the default settings.

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Set the FREQUENCY to the
value recommended

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by the inspection procedure.

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For this video, we will use

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the default value of 10 kHz.

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Set any other parameters as needed

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if required by the procedure.

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Ensure the probe tip is
covered with Teflon™ tape

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or an equivalent protection film.

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Never inspect with damaged
tape as this will scratch

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the surface and damage the probe.

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You may use backing foam to
achieve better results.

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Place the probe on an area
free of defects

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and press the NULL key.

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It’s important to know
where the simulated defects

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are located to avoid mistakes
during calibration.

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Maintain a constant
pressure on the probe tip.

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One easy way to keep
the pressure constant

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is to use the weight of your forearm

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to press the probe
against the surface.

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This helps ensure constant
pressure and minimal effort.

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Slowly scan over the simulated disbond

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while maintaining constant pressure.

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When done, press the FREEZE key.

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Press the GAIN key and
adjust the sensitivity

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to have the disbond at 70% to 90%
of the full screen height.

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If needed, adjust the
ANGLE of the signal.

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The basic calibration is now complete.

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Press FREEZE again
to restart acquisition

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and scan the entire standard.

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In this example, the small
disbond goes upward

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on the screen while a
repaired area goes down,

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enabling indications
to be easily identified.

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Part Two - Advanced Functionalities
for Procedure Writing

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Now we’ll discuss how to
define working parameters

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for inspecting honeycomb
composite with the MIA mode.

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This section is targeted at
users who write procedures

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or develop bond testing applications.

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The most critical parameter
is the test frequency.

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Assuming you have a
working MIA configuration,

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press and hold the NULL/CAL key

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to enter the frequency
calibration mode.

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Maintain the probe
on the disbonded area

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while keeping a constant pressure.

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Hold the probe as straight as possible

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and aim for the center
of the disbond defect.

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While you hold the probe,

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the instrument will
self-adjust its sensitivity.

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Once you feel the instrument
has stabilized,

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press the BAD PART key.

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Move the probe onto
a defect-free area,

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hold it there, and
press the GOOD PART key.

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Your result should resemble
the following screen.

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Watch for the spectrum peaks.

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If you mostly obtain a
single negative peak,

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this is a sign that the
calibration went very well.

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In that case, press DONE.

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However, if you obtain several peaks,

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this may be a sign of problems

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or a failed calibration.

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If you have a problem,
first try pressing BACK

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and re-doing the entire
frequency calibration process.

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This often solves the problem
when it’s caused

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by incorrect probe positioning
or uneven pressure.

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In rare cases,
the composite application

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is just very difficult to solve,

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and you will always
obtain several peaks

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during the frequency calibration.

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When that happens,
we recommend using

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the first strong negative
peak for frequency selection.

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Press DONE to exit
the calibration menu.

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The next critical parameter to set

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is the GAIN and/or PROBE DRIVE.

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Since the MIA probe exhibits a strong

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difference in sensitivity
along its frequency range,

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it is critical to ensure that
the combination of GAIN

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and PROBE DRIVE does
not cause signal saturation.

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Be aware that gains over 55 dB

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may be needed at
frequencies below 10 kHz,

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but gains as low as
25 dB may be required

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at frequencies around 15 kHz.

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In summary, if you observe
or suspect saturation,

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remember to check the GAIN

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and possibly lower the
PROBE DRIVE as needed.

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We hope you enjoyed this video

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on detecting smaller disbonds
in honeycomb composite

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using the mechanical
impedance analysis method.

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For more information about
Olympus bond testing solutions,

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contact your local representative

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or visit www.olympus-ims.com.