BondMaster

The BondMaster 1000e+ allows users to select the best method for a particular application and to inspect a wide variety of composite materials. Its high performance, light weight, and rugged durability make it the ideal choice for applications related to the manufacturing, maintenance, and repair of composite materials.

With customer-interchangeable displays, the BondMaster 1000e+ offers users the highest resolution available today. The availability of a color or monochrome LCD for indoor or bright outdoor conditions, or a high-bright electroluminescent display (ELD) for normal to dark conditions provides the ultimate in flexibility and convenience. Its rugged, well-designed housing, uncomplicated front panel, SmartKnob™, and built-in PowerLink™ technology make the BondMaster 1000e+ a truly revolutionary and user-friendly handheld flaw detector.

The BondMaster 1000e+ uses PowerLink technology to automatically configure the instrument when a probe is connected. Built-in calibration modes assist the user in optimizing the test parameters. A variety of probes is available for each of the test technologies.

Features

Improved processor speed (up to 10 times faster)
Full multimode capability:
- Pitch-catch (RF, impulse, swept)
- MIA (mechanical impedance analysis)
- Resonance
Customer-interchangeable displays:
- High-bright electroluminescent
- Monochrome liquid crystal
- Color liquid crystal
Improved screen displays:
- Split-screen displays (P-C RF, P-C impulse)
- Outdoor display
VGA output
Field-replaceable Li-ion battery
Lightweight, 2 kg (4.4 lb)
USB output (via adapter) for printer or computer interface
Alarm outputs
Program and trace storage
PowerLink technology provides automatic probe recognition and instrument setup
High-voltage pitch-catch probes are available

BondMaster 1000e+ Specifications

Inspection Methods
When a probe is connected to the BondMaster™ 1000e+, the instrument is automatically configured for the probe type.
The five inspection methods are pitch-catch (RF, impulse, and swept), MIA (mechanical impedance analysis), and resonance.
Pitch-Catch RF: Measures amplitude and phase changes using a short burst of energy to detect disbonds. Displays information in envelope or vector display format. An impedance display is available from the RF data. Requires no couplant.
Pitch-Catch Impulse: Measures amplitude and phase changes using a short burst of energy to detect disbonds. Displays information in envelope or vector display format. Requires no couplant.
Pitch-Catch Swept: Measures amplitude and phase changes using a swept frequency method to detect disbonds. Requires no couplant (5 kHz to 100 kHz).
MIA: Measures the stiffness characteristics of the material under test. The output is measured in both phase and amplitude. Requires no couplant.
Resonance: Detects disbonds by changes in phase and amplitude of probe resonance. Requires couplant.

Inputs and Outputs

Probe Connector: 11-pin Fisher

Analog Outputs: Signals: ±5 V, adjustable offset, not affected by position controls or zoom function.

Technical Specifications

Frequency Range: 250 Hz to 1.5 MHz. Specific test modes may have limitations within this range.

Gain: -10 dB to 50 dB

Analog Output Update: Continuous rate in MIA and resonance mode. Data available at repetition rate for all pitch-catch methods.

Alarm Box: The instrument allows for any size alarm box. The box can be defined and located anywhere on the screen. An adjustable vertical-amplitude alarm operates in the RF and impulse setup mode.

Alarm Logic: Positive or negative alarm gate

Alarm Output: 0 V to 3 V HC logic output, switchable audible alarm, and front panel annunciator. Alarm indicator on probe is standard.

Clock and Calendar: Time and date are stored and printed with each waveform.

Languages: Menus can be displayed in English, Spanish, French, or German.

RS-232/USB Interface: Screen printout and computer interface. USB out is via an RS-232 adapter.

Screen Storage: Up to 20 screens can be stored.

Program Storage: Up to 100 instrument setups can be stored.

General

Dimensions: 9.5" L x 5.5" H x 3.6" D (215 mm x 165 mm x 92 mm)

Weight: 2 kg (4.4 lb)

Display: Customer-interchangeable QVGA displays (320 pixels x 240 pixels): color or monochrome LCD, high-bright electroluminescent

Operating Temperature: −20 °C to 60 °C (−4 °F to 140 °F)

Storage Temperature: −40 °C to 80 °C (−40 °F to 176 °F)

Humidity: 95 % ± 5 %

Classification: Complies with Class 2 specifications from the MIL-PRF-28800F Handbook.

Altitude: Maximum operating and nonoperating altitude is 4,600 m (15,000 ft).

Hazardous Area Operation: Safe operation as defined by Class I, Division 2, Group D, as found in the National Fire Protection Association Code (NFPA 70), Section 500, and tested using MIL-STD-810F, Method 511.4, Procedure 1.

Power

Power: 7-pin connector to charge the internal batteries and operate the instrument from AC power

Power Requirements: 85 V to 240 V, 50 Hz to 60 Hz mains. External holder charges batteries outside the instrument. Charging time is typically 4 h.

Low Battery Protection: Display bar graph indicates approximate operating time.

Battery Operating Time: 6 h to 8 h (nominal, depending on configuration)

Probes and Accessories
All BondMaster™ 1000e+ probes include PowerLink™ functionality. Pitch-catch (S-PC), MIA (S-MP), and resonance (S-PR) probes are available.
BondMaster PC Interface Software: Enables data transfer to PC.

Pitch-Catch Probes

Pitch-Catch mode uses high-frequency sound waves to transmit surface waves into the test part. A separate receiving element, a set distance from the transmitter, picks up the energy transmitted into the material. The sound waves are carried in a plate-wave mode across the test piece between the two probe tips.

Part Code	Item Number	Description
9317797	U8010012	S-PC-P11: Spring-loaded tips, 17 mm (0.67 in.) tip spacing, low voltage
9322074	U8770334	S-PC-P12: Fixed tips, 17 mm (0.67 in.) tip spacing, high voltage
9322076	U8770336	S-PC-P13: Spring-loaded tips, 17 mm (0.67 in.) tip spacing, high voltage
9323945	U8800601	S-PC-P14: Spring-loaded tips, 15 mm (0.59 in.) tip spacing, high voltage
9323954	U8629399	S-PC-P15: Spring-loaded tips, 13mm (0.51 in.) tip spacing, high voltage
9323952	U8010062	S-PC-P16:Spring-loaded tips, 15 mm (0.59 in.) tip spacing, high voltage
9322184	U8010039	SPO-5629-PHV: Spring-loaded tips, 13 mm (0.51 in.) tip spacing, high voltage.
9323942	U8010054	S-PC-DHV: Differential High Voltage, four spring-loaded tips

MIA Probes

The Mechanical Impedance Analysis (MIA) test mode uses a single-tipped dual-element probe. A drive element generates sound waves and a receive element detects the effect of the structure on probe-tip loading.

Part Code	Item Number	Description
9317806	U8010013	S-MP-1: Right angle probe, 12.7 mm (0.5 in.) tip diameter.
9317807	U8010014	S-MP-2: Straight probe, 6.35 mm (0.25 in.) tip diameter.
9317796	U8010011	S-MP-3: Right angle probe, 12.7 mm (0.5 in.) tip diameter.
9317808	U8010015	S-MP-4: Right angle probe, 6.35 mm (0.25 in.) tip diameter.
9322075	U8770335	S-MP-5: Right angle probe, 12.7 mm (0.5 in.) tip diameter.

Resonance Probes

The Resonance mode contact transducer is driven at its resonant frequency and coupled to the sample using a low-viscosity couplant. Impedance changes in the sensor are analyzed to detect changes in the test sample.

Part Code	Item Number	Description
9317809	U8010016	S-PR-1: 35 kHz (±5 kHz) in a 15.9 mm (0.63 in.) diameter case
9317810	U8010017	S-PR-2: 65 kHz (±10 kHz) in a 15.9 mm (0.63 in.) diameter case
9317793	U8010008	S-PR-3: 110 kHz (±10 kHz) in a 15.9 mm (0.63 in.) diameter case
9317794	U8010009	S-PR-4: 165 kHz (±10 kHz) in a 12.7 mm (0.5 in.) diameter case
9317795	U8010010	S-PR-5: 250 kHz (±10 kHz) in a 9.5 mm (0.37 in.) diameter case
9317811	U8010018	S-PR-6: 330 kHz (±10 kHz) in a 9.5 mm (0.37 in.) diameter case

Kits

Part Code	Item Number	Description
BM-KIT-PC1	U8010069	BondMaster Probe and Standard Kit for Pitch-Catch Inspections Contains: NEC-6407 Reference Standard with S-PC-P14 Pitch-Catch Probe and Cable
BM-KIT-PC2	U8010070	BondMaster Probe and Standard Kit for Pitch-Catch Inspections Contains: NEC-6407 Reference Standard with S-PC-P14 and SPO-5629PHV Pitch-Catch Probes and Cable
BM-KIT-MIA	U8010071	BondMaster Probe and Standard Kit for MIA Inspections Contains: NEC-6407 Reference Standard with S-MP-3 MIA Probe and BMM-H Spring Holder and Cable
BM-KIT-RES-C	U8010072	BondMaster Probe and Standard Kit for Resonance Inspections Contains: NEC-6382 Composite Reference Standard with S-PR-4 Resonance Probe, Couplant and Cable
BM-KIT-RES-A	U8010073	BondMaster Probe and Standard Kit for Resonance Inspections Contains: NEC-6384 Aluminum Reference Standard with S-PR-4 Resonance Probe, Couplant and Cable
BM-KIT-PMR	U8010074	BondMaster Probe and Standard Kit for Pitch-Catch, MIA and Resonance Inspections Contains: NEC-6407 Reference Standard, S-PC-P14 and SPO-5629PHV Pitch-Catch Probes, S-MP-3 MIA Probe with BMM-H Spring Holder, NEC-6382 Composite Reference Standard, NEC-6384 Aluminum Reference Standard, S-PR-4 Resonance Probe, Couplant and Cables